Subject: Recent ESNUG contributor, Robert Patti, gets 2009 SEMI award

It's always fun to see ESNUG contributor names popping up unexpectedly.  In
this case, Robert Patti of Tezzaron, who wrote ESNUG 483 #2:

    "We recently dumped Mentor Calibre for Magma Quartz DRC/LVS"
            http://www.deepchip.com/items/0483-02.html

was just given the 2009 SEMI Award.

From the press release:

  The first SEMI Award for 2009 will be presented to Robert Patti, the
  chief technology officer of Tezzaron, Inc., for his pioneering work
  in the emerging technical area of 3D IC integration.

  Robert Patti is recognized in the industry as one of the most
  knowledgeable and hands-on practitioners of 3D IC development.  He is
  a leader in the current global discussions charting the direction of
  3D ICs.  Patti was among the first to identify some of the limitations
  associated with certain copper through-silicon via (TSV) structures
  and potential solutions.

  Patti has been the main driver for the 3D-IC Alliance, which has
  produced the first published standard for three-dimensional chip
  designs: a specification for integrating memory and logic in a 3D
  stack. This standard lays the cornerstone for memory-to-logic 3D
  integration and establishes a basis for future collaborative efforts
  in the industry.

The thing that interested me the most was that Robert wrote specifically
about designing 3D IC's in this exact ESNUG 483 #2 letter!  Cool!

SEMI is the global industry association serving the manufacturing supply
chains for the microelectronic, display and photovoltaic industries.

My congrats to Robert!

    - John Cooley
      DeepChip.com                               Holliston, MA